Samsung Electronics Begins Production of Thinner LPDDR5X DRAM Packages for AI in Devices

Samsung Electronics, a global leader in advanced memory technology, has announced that it has begun mass production of the industry’s thinnest 12-nanometer LPDDR5X DRAM packages, available in capacities of 12 and 16 gigabytes (GB). This innovation strengthens its dominant position in the low-power DRAM market.

The new LPDDR5X DRAM package stacks four layers of 12nm class DRAM integrated circuits, reducing thickness and improving heat resistance while increasing density. This technology enables greater thermal control, making it ideal for advanced mobile applications with artificial intelligence on the device.

“Samsung’s LPDDR5X DRAM sets a new standard for high-performance AI solutions in devices, offering not only superior LPDDR performance, but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”

These new Samsung LPDDR5X packages, the industry’s thinnest 12nm class, feature a four-layer structure that reduces thickness by approximately 9% and improves heat resistance by around 21.2%, compared to the previous generation.

By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, Samsung has achieved a LPDDR DRAM package as thin as a fingernail, measuring just 0.65 millimeters (mm), the thinnest among existing 12GB or larger LPDDR DRAMs. Additionally, an optimized back grinding process has been used to minimize package height.

Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor manufacturers, as well as mobile device manufacturers. As demand grows for high-performance, high-density mobile memory solutions in smaller package sizes, the company plans to develop 6-layer 24GB and 8-layer 32GB modules in the thinnest LPDDR DRAM packages for future devices.

via: MiMub in Spanish

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